1 option
HIGH POWER SURFACE MOUNT PACKAGES ST Microelectronics, Incorporated
- Format:
- Conference/Event
- Author/Creator:
- Hundt, Michael, author.
- Conference Name:
- International Congress & Exposition (1998-02-23 : Detroit, Michigan, United States)
- Language:
- English
- Physical Description:
- 1 online resource
- Place of Publication:
- Warrendale, PA SAE International 1998
- Notes:
- Vendor supplied data
- Publisher Number:
- 980349
- Access Restriction:
- Restricted for use by site license
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