Thermal Characterization of Integrated Circuit Packages for Electronic Engine Control Motorola Semiconductor Products Sector

Format:

Conference/Event

Author/Creator:

Kanner, Jeff, author.

Conference Name:

International Congress & Exposition (1997-02-24 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1997

Summary:

Effective use of power integrated circuit packages in automotive systems requires thermal models. This paper provides detailed information on the transient and steady state characterization and modeling of power SOIC packages. Sixteen and twenty four pin wide body SOICs are analyzed in FR4 and polyimide systems. Model extraction, generation, and validation are presented. To validate the model, data taken in an electronic fuel injection system is analyzed and then compared to the simulation results. The model results show 3 % correlation to the actual data

Notes:

Vendor supplied data

Publisher Number:

970862

Access Restriction:

Restricted for use by site license