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Rapid Measurement of Residual Stress by Computerized Shearography Oakland Univ

SAE Technical Papers (1906-current) Available online

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Format:
Book
Conference/Event
Author/Creator:
Hung, Y. Y., author.
Conference Name:
International Congress & Exposition (1996-02-26 : Detroit, Michigan, United States)
Language:
English
Physical Description:
1 online resource cm
Place of Publication:
Warrendale, PA SAE International 1996
Summary:
This paper presents an optical method for evaluating residual stresses. The approach is based on measuring the deformation due to the relief of stress produced by a blind-hole drilling technique. The deformation is rapidly measured by shearography. Unlike the strain gage method, this method does not require mounting strain gages /transducers. A rapid process for detection of residual stress using a micro-indentation technique is also present. The method is practical for employment in a production/field environment
Notes:
Vendor supplied data
Publisher Number:
960974
Access Restriction:
Restricted for use by site license

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