Thermal Study of Electric Devices in Electrical Distribution Box Alcoa Fujikura Limited

Format:

Conference/Event

Author/Creator:

Yang, Qinghui (Wendy), author.

Conference Name:

SAE International Congress & Exposition (1997-02-24 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1997

Summary:

The objective of this study is to assist in understanding and predicting the thermal operating behavior of electrical devices in vehicle Electrical Distribution Box (EDB), and to provide a thermal design model which can be used to aid new EDB design. In this work, the temperature characteristics of one of the electric devices, Micro ISO Relay, in EDBs, were studied in detail through the combination of experiments and finite element analysis from the individual device level to the assembled EDB level. This study reveals the relationship of the temperature profile in EDBs with a wide range of variables, such as current loads, device location, content and operating environment. A thermal design model including the current loads and geometric arrangement of the electrical devices in EDBs was parametrically developed. A good correlation between the experiment and the model's prediction was observed

Notes:

Vendor supplied data

Publisher Number:

970303

Access Restriction:

Restricted for use by site license