Truck Electronic Packaging

Format:

Conference/Event

Author/Creator:

Weyer, Rob, author.

Conference Name:

International Truck and Bus Meeting & Exposition (1995-11-13 : Winston-Salem, North Carolina, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1995

Summary:

Electronic controls continue to propagate on vehicles in the truck industry. Many people, including engineering design personnel, do not fully understand the design, development, test, and manufacturing process for electronics. This paper specifically reviews design and test techniques necessary to produce a reliable electronic package. Potential benefits of a superior mechanical package include ease of installation and service, simple manufacturing process techniques, and protection from surrounding environmental conditions

Notes:

Vendor supplied data

Publisher Number:

952628

Access Restriction:

Restricted for use by site license