1 option
Thermal Physics of Failure
- Format:
- Conference/Event
- Author/Creator:
- Perez, Rigo, author.
- Conference Name:
- Reliability, Maintainability, Supportability & Logistics (Rmsl) Conference & Workshop (1996-05-20 : Dallas, Texas, United States)
- Language:
- English
- Physical Description:
- 1 online resource
- Place of Publication:
- Warrendale, PA SAE International 1996
- Summary:
- Temperature changes cause thermo-mechanical stresses and creep in solder joints of electronics. These conditions induce cracking in the solder and eventual failure of the electronic component. This paper describes procedures for predicting the lifetime to failure of electronics exposed to thermal cycling
- Notes:
- Vendor supplied data
- Publisher Number:
- 961266
- Access Restriction:
- Restricted for use by site license
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