Metal Microchannel Coolers for High Heat Flux Applications Saddleback Aerospace

Format:

Conference/Event

Author/Creator:

Campbell, G. O., author.

Conference Name:

Aerospace Atlantic Conference & Exposition (1995-05-23 : Dayton, Ohio, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1995

Summary:

Theoretical comparisons of the performances of copper and silicon microchannel coolers are presented. The fabrication and testing of copper microchannel coolers with microchannel passage widths of 32 μm and 63.5 μm is described. Both a straight channel and a jet impingement design were built. The thermal performance of the copper coolers is shown to be slightly higher than that of comparable silicon coolers at greatly reduced pumping powers. The jet impingement design is shown to perform better than the straight channel design

Notes:

Vendor supplied data

Publisher Number:

951442

Access Restriction:

Restricted for use by site license