Solvent-Free Adhesive Technology for Instrument Crash Pad Vacuum Forming Honda Research and Development Company, Limited

Format:

Conference/Event

Author/Creator:

Ohyama, Makoto, author.

Conference Name:

International Congress & Exposition (1995-02-27 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1995

Summary:

Two-part water-based adhesive for instrument crash pad vacuum forming was developed. It uses a self-emulsification type of urethane emulsion which does not contain any organic solvents as its main ingredient. And, a number of additives which are effective in improving adhesion to both an injection molded acrylonitrile-butadiene-styrene (ABS) foundation and the PVC/PPF skin have been blended in this urethane emulsion. So, this water-based adhesive has excellent initial adhesive properties, reliable durability and mass productivity which are all required of adhesives for instrument crash pad applications

Notes:

Vendor supplied data

Publisher Number:

950123

Access Restriction:

Restricted for use by site license