Development of Highly Durable IDC Connectors Fujikura Limited

Format:

Conference/Event

Author/Creator:

Enomoto, Kazuo, author.

Conference Name:

International Congress & Exposition (1995-02-27 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1995

Summary:

The thermal stresses of various joints between contacts and wire conductors in Insulation Displacement Contact (IDC) connectors were calculated by the finite element method, and the life of each joint was predicted qualitatively. Next, several connectors evaluated well durable at the prediction were subjected to 1,000-hour combined environmental testing. Consequently, a highly reliable IDC connector for automotive applications was developed. Furthermore the predicted life trend of the connectors virtually agreed with the environmental test results

Notes:

Vendor supplied data

Publisher Number:

950302

Access Restriction:

Restricted for use by site license