New Accelerometer Based on Innovative Packaging and Circuit Design EG&G IC Sensors

Format:

Conference/Event

Author/Creator:

de Bruin, Diederik W., author.

Conference Name:

International Congress & Exposition (1995-02-27 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1995

Summary:

A signal-conditioned accelerometer is described which offers many advantages to the user. The sensor element, manufactured using silicon micromachining, has proven reliability. The signal conditioning does not require external components and thick or thin film technology but is done entirely within a monolithic IC. The sensor and signal conditioning chips are hermetically packaged together in a ceramic leadless chip carrier. The output parameters are trimmed electrically after packaging is completed. The chip carrier can be mounted in several orientations to allow measurement of acceleration either perpendicular to or in plane with the mounting surface

Notes:

Vendor supplied data

Publisher Number:

951018

Access Restriction:

Restricted for use by site license