Thermal Model Correlation Using Design Sensitivity and Optimization Techniques - Continued Progress Orbital Sciences Corporation

Format:

Conference/Event

Author/Creator:

DeMauro, Frank, author.

Conference Name:

International Conference on Environmental Systems (1995-07-10 : San Diego, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1995

Summary:

An automated procedure has been developed for correlating thermal models with test or flight data. The procedure achieves model correlation by determining the best combination of changes to a thermal model's conductor properties in order to minimize the differences between model temperature predictions and measured data. This procedure has been developed for use with the SINDA thermal analyzer program, but the methods are general and apply equally to other thermal programs, such as ESATAN. The method is based on design sensitivity and optimization techniques and utilizes the solution sequences available in MSC/NASTRAN. The thermal model is reformulated into an equivalent structural model, which is then optimized using built-in MSC/NASTRAN routines to match specified results.Continued effort has been expended in improving the performance of the correlation techniques. The improved techniques have been utilized in the thermal model correlation of simulated thermal balance tests for two models of different complexity. This paper summarizes the initial efforts, provides details on performance trade studies and implemented improvements, and presents results from the use of the routines in thermal model correlation for simulated thermal balance tests

Notes:

Vendor supplied data

Publisher Number:

951609

Access Restriction:

Restricted for use by site license