Ultra-High Thermal Conductivity Substrate for Electronic Components Applied Sciences, Incorporated

Format:

Conference/Event

Author/Creator:

Lake, Max L., author.

Conference Name:

Aerospace Technology Conference & Exposition (1994-10-01 : San Diego, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1994

Summary:

The development of chemically vapor deposited (CVD) diamond promises to greatly impact numerous technologies, and in particular the field of thermal management. Despite its current high cost, the physical properties of CVD diamond are so attractive, compared to currently implemented materials, that its use is justified in a few demanding or previously impossible applications. Unfortunately, at $50 or more per carat, the cost/performance ratio is well beyond the limits that would make it useful for many more widely spread applications. This paper describes an affordable variant of CVD diamond that is under development for thermal management in electronics. This material, designated "diamond/carbon/carbon composite," consists of a carbon/carbon composite that is partially infiltrated with CVD diamond in the surface region. The performance advantages of DCC relative to current thermal management materials are analyzed, and the cost advantages relative to pure CVD diamond are discussed

Notes:

Vendor supplied data

Publisher Number:

942186

Access Restriction:

Restricted for use by site license