Design and Development of a Generic Door Hardware Module Concept GE Plastics

Format:

Conference/Event

Author/Creator:

Hoff, Todd, author.

Conference Name:

International Congress & Exposition (1998-02-23 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1998

Summary:

This paper documents the design methodology, part performance, and economic considerations for a generic hardware module applied to a front passenger-car door. Engineering thermoplastics (ETPs), widely used in automotive applications for their excellent mechanical performance, design flexibility, and parts integration, can also help advance the development of modular door-hardware systems. Implementation of these hardware carriers is being driven by pressures to increase manufacturing efficiencies, reduce mass, lower part-count numbers, decrease warranty issues, and cut overall systems costs. In this case, a joint team from GE Plastics, Magna-Atoma International/Dortec, and Excel Automotive Systems assessed the opportunity for using a thermoplastic door hardware module in a current mid-size production vehicle. Finite-element analysis showed that the thermoplastic module under study withstood the inertial load of the door being slammed shut at low, room, and elevated temperatures

Notes:

Vendor supplied data

Publisher Number:

980999

Access Restriction:

Restricted for use by site license