Thermal Performance of Embedded Heat Pipe Spacecraft Radiator Panels COMSAT Laboratories, Clarksburg, MD

Format:

Conference/Event

Author/Creator:

Kelly, W. H., author.

Conference Name:

International Conference On Environmental Systems (1993-07-12 : Colorado Springs, Colorado, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1993

Summary:

The embedded heat pipe radiator panel is the thermal foundation for the present and future-generation three-axis-stabilized, geosynchronous communications spacecraft. This paper discusses design guidelines and analyzes the thermal performance of some commonly used heat pipe/panel configurations. Among the designs considered are an in-plane design with heat pipes bonded to each other in overlapping sections, an in-plane design with heat pipes crossing on two levels, and externally mounted heat pipes. The thermal performance parameters are quantified and compared as a function of radiator area and weight

Notes:

Vendor supplied data

Publisher Number:

932158

Access Restriction:

Restricted for use by site license