Diamond/Carbon/Carbon Composite Coldplates for Aerospace Thermal Management Applied Sciences, Incorporated

Format:

Conference/Event

Author/Creator:

Lake, Max, author.

Conference Name:

Aerospace Atlantic Conference & Exposition (1994-04-19 : Dayton, Ohio, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1994

Summary:

In this paper, we describe our accomplishments in infiltrating a carbon/carbon composite material with polycrystalline diamond. This development results in an ultra high thermal conductivity electronics baseplate featuring an electrically insulating coating with high thermal conductivity. This novel composite material exhibits thermal conductivity higher than all existing coldplate materials. We have prepared diamond-infiltrated composites, and characterized the resulting material including the thermal conductivity measurement of the base carbon/carbon, SEM and Raman spectroscopy, and DC electrical resistivity measurements of the integrated diamond/carbon/carbon composites. We have achieved metallization of the diamond surface, demonstrating in part the feasibility of surface mount technology applied to the dielectric heat sink composite. We discuss our technical accomplishments to date, our objectives for the ongoing technical program and future applications of this material

Notes:

Vendor supplied data

Publisher Number:

941181

Access Restriction:

Restricted for use by site license