Multi-Chip Modules for Automotive Applications

Format:

Conference/Event

Author/Creator:

McCaffrey, Patrick J., author.

Conference Name:

Future Transportation Technology Conference and Exposition (1993-08-08 : San Antonio, Texas, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1993

Summary:

Increased functionality, increased reliability and reduced system costs have been the driving forces behind silicon integration. However, conventional packaging options are becoming a barrier both technologically and in terms of cost effectiveness to further silicon integration. Multi-chip modules (MCMs) provide a cost effective solution to handling the most advanced of silicon chips while increasing reliability. An example of an automotive system which merits the use of thin film (MCM-D) technology is described. The preferred type of interconnect for this circuit together with the alternatives is discussed, with emphasis on the multi-chip module substrate

Notes:

Vendor supplied data

Publisher Number:

931838

Access Restriction:

Restricted for use by site license