SPICE Models for Thermal and Vibration Analysis of Printed Circuit Boards

Format:

Conference/Event

Author/Creator:

Chen, Jesse E., author.

Conference Name:

27th Intersociety Energy Conversion Engineering Conference (1992) (1992-08-03 : San Diego, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1992

Summary:

This paper describes circuit models for characterizing the thermal and dynamic behavior of printed circuit boards. The thermal model simulates the transient temperature distribution resulting from dissipative components and conductive, convective, and radiative boundaries. The dynamic model predicts the fundamental frequency for clamped edges. Both models are based on finite difference equations and confirmed by traditional methods

Notes:

Vendor supplied data

Publisher Number:

929318

Access Restriction:

Restricted for use by site license