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Lifetime modeling for silicon carbide based power module STMicroelectronics
- Format:
- Book
- Conference/Event
- Author/Creator:
- Calabretta PhD, Michele, author.
- Conference Name:
- 15th International Conference on Engines & Vehicles (2021-09-12 : Capri, Italy)
- Language:
- English
- Physical Description:
- 1 online resource cm
- Place of Publication:
- Warrendale, PA SAE International 2021
- Summary:
- Semiconductor power modules is one of the main hardware components of a traction inverter. Its function is motor speed and torque driving, managing the energy exchange between battery and motor. The demanding request for electric and hybrid vehicle is pushing the development of innovative high performance power modules based on wide band gap compound. Silicon Carbide (SiC) power MOSFET modules are one of the most promising solution thanks to SiC excellent electrical properties in terms of on-state resistance, stray inductance and performance at high commutation frequency. These advantages shall be supported by innovative packaging solution, such as direct cooling system and novel insulator materials with high thermal conductivity (e.g., active metal brazed substrates) that improve the power module thermal and reliability performances. From this point of view, a methodology to predict the power module lifetime according to costumer mission profile is fundamental to optimize power module durability since design stage. The purpose of the proposed activity is to develop a methodology that translates the customer conditions in terms of electric power into thermo-mechanical variables correlated with power module failure mechanisms. An initial analysis of power module failure modes will be presented with an estimation of junction temperature during inverter operations. The so-obtained time-temperature during inverter operation will be converted using Rainflow-like approach into a pre-defined number of loading conditions. According to the time and temperature dependency of the typical failure mechanisms, the mentioned loading cases will be characterized by different temperature swing, average temperature and time duration. The extrapolated equivalent history will be a starting point to set durability tests and to develop finite element model aimed to predict reliability performances
- Notes:
- Vendor supplied data
- Publisher Number:
- 2021-24-0102
- Access Restriction:
- Restricted for use by site license
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