Development of TLP-AI Technology to Realize High Temperature Operation of Power Module Toyota Motor Corporation

Format:

Book

Conference/Event

Author/Creator:

Asai, Asai, author.

Contributor:

Aoshima, Masaki

Ito, Hirofumi

Usui, Masanori

Conference Name:

WCX SAE World Congress Experience (2019-04-09 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource cm

Place of Publication:

Warrendale, PA SAE International 2019

Summary:

AbstractApplication of SiC power devices is regarded as a promising means of reducing the power loss of power modules mounted in power control units. Due to those high thermostable characteristics, the power module with SiC power devices are required to have higher operating temperature than the conventional power module with Si power devices. However, the limitations of current packaging technology prevent the utilization of the full potential of SiC power devices. To resolve these issues, the development of device bonding technology is very important. Although transient liquid phase (TLP) bonding is a promising technology for enabling high temperature operation because its bonding layer has a high melting point, the characteristics of the TLP bonding layer tend to damage the power devices. This paper describes the development of a bonding technology to achieve high temperature operation using a stress reduction effect. Called transient liquid phase bonding with an aluminum interlayer (TLP-AI), this method utilizes the high melting point and ductility of aluminum to reduce the device stress of power modules. The developed method lowers device stress by approximately 44% compared to conventional TLP bonding. After a thermal cycling test (-40°C 175°C, 3,000 cycles) no cracks were observed in the aluminum interlayer. Moreover, after a power cycling test (30°C 175°C, 100,000 cycles), crack propagation was reduced by approximately 80% compared to conventional solder bonding

Notes:

Vendor supplied data

Publisher Number:

2019-01-0607

Access Restriction:

Restricted for use by site license