Some Thoughts on Dissipative Sound Package Systems Kolano and Saha Engineers Incorporated

Format:

Conference/Event

Author/Creator:

Saha, Saha, author.

Contributor:

Deshpande, Satyajeet P.

Conference Name:

Noise and Vibration Conference and Exhibition (2017-06-12 : Grand Rapids, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2017

Summary:

AbstractThis paper discusses the importance of a dissipative sound package system in the automotive industry and how it works. Although this is not a new technique at this stage, it is still a challenge to meet the subsystem target levels that were originally developed for parts based on the barrier decoupler concept. This paper reviews the typical construction of a dissipative system and then emphasizes the importance of different layers of materials that are used in the construction, including what they can do and cannot do. The paper also discusses the importance of the proper manufacturing of a part

Notes:

Vendor supplied data

Publisher Number:

2017-01-1815

Access Restriction:

Restricted for use by site license