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High-Temperature, Distributed Control using Custom CMOS ASICs Scientific Monitoring Incorporated
- Format:
- Conference/Event
- Author/Creator:
- Majerus, Majerus, author.
- Conference Name:
- SAE 2012 Power Systems Conference (2012-10-30 : Phoenix, Arizona, United States)
- Language:
- English
- Physical Description:
- 1 online resource
- Place of Publication:
- Warrendale, PA SAE International 2012
- Summary:
- Four application specific integrated circuits (ASICs) which provide sensing, actuation, and power conversion capabilities for distributed control in a high-temperature (over 200°C) environment are presented. Patented circuit design techniques facilitate fabrication in a conventional, low-cost, 0.5 micron bulk Complimentary Metal Oxide Semiconductor (CMOS) foundry process. The four ASICs are combined with a Digital Signal Processor (DSP) to create a distributed control node. The design and performance over temperature of the control system is discussed. Various applications of the control system are proposed. The authors also discuss various design techniques used to achieve high reliability and long life
- Notes:
- Vendor supplied data
- Publisher Number:
- 2012-01-2210
- Access Restriction:
- Restricted for use by site license
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