An Experience Report: Step Stress Testing to Failure for Reliability Analysis of Electronic Equipment Grumman Aircraft Engineering Corporation

Format:

Conference/Event

Author/Creator:

Bussolini, J. J., author.

Conference Name:

SAE World Congress & Exhibition (1964-01-01 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1964

Summary:

This paper presents the results of a planned program to investigate step-stress-to-failure testing as a technique for design improvement and reliability evaluation of electronic equipment. The test philosophy is presented along with a discussion of the test set-up, method of data analysis, implications from test results, and advantages over present failure rate type testing. The implications and recommendations made are based on an actual test-to-failure performed on an item of modular electronic equipment

Notes:

Vendor supplied data

Publisher Number:

640604

Access Restriction:

Restricted for use by site license