A Novel Approach to Microcircuit Interconnection and Packaging Sperry Gyroscope Company, Div., Sperry Rand Corporation

Format:

Conference/Event

Author/Creator:

Cohen, Norman I., author.

Conference Name:

Electronic Packaging Conference (1965-10-20 : Los Angeles, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1965

Summary:

As electronic components and circuits get smaller the problems of mounting and interconnecting elements into a system become more difficult. This paper indicates how one packaging concept using a carrier-mother board, rack approach, interconnected by wire-wrap techniques solves some of the problems imposed by these small components. Flexibility, cost, reliability and their influence on the selection of the final configuration are investigated. The application of hot gas soldering for mounting flat packs to carriers is described along with the advantages gained by its use

Notes:

Vendor supplied data

Publisher Number:

650851

Access Restriction:

Restricted for use by site license