Weld Stress Evaluation Electronic Modules Lockheed Missiles and Space Company

Format:

Conference/Event

Author/Creator:

Dorfman, Herbert, author.

Conference Name:

Electronic Packaging Conference (1965-10-20 : Los Angeles, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1965

Summary:

Welded joints of electronic modules are adversely stressed by some encapsulants, especially when subjected to temperature cycling. Weld joints of specific tensile strengths were developed, encapsulated with various resins, and temperature-cycled to determine failure caused by internal stress. Resins with high coefficients of thermal expansion and high shrinkage values caused weld failures after cure. Furthermore, stress reduction can be accomplished by proper spacing of weld interconnects

Notes:

Vendor supplied data

Publisher Number:

650856

Access Restriction:

Restricted for use by site license