The Correlation of Microstructure, Microhardness, and Microchemistry in Resistance Welded Electronic Leads Ratheon Company

Format:

Conference/Event

Author/Creator:

Breen, J. E., author.

Conference Name:

Electronic Packaging Conference (1965-10-20 : Los Angeles, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1965

Summary:

A study was made on the nature of the weld interface obtained in resistance welding of component leads used in electronic packages. To this end an investigation was made comparing the microstructure, microhardness, and microchemistry of a variety of cross wire resistance welds. Specifically, the investigation concerned itself with the variations in microhardness, and microchemistry at and near the weld interface as a function of metallographic structure, distance from the interface, and type of material being welded.This study will help answer such questions as the amount of diffusion of one weld component into another, the effects of welding on the mechanical properties near and adjacent to the weld, and provide for a more intelligent interpretation of the variety of microstructures that have been observed.The results of this work can be summarized as follows:

Notes:

Vendor supplied data

Publisher Number:

650857

Access Restriction:

Restricted for use by site license