Evaluation of the Resistance Microwelding Process by Infrared Energy Measurements Lockheed Missiles and Space Company

Format:

Conference/Event

Author/Creator:

Lee, James K. S., author.

Conference Name:

Electronic Packaging Conference (1965-10-20 : Los Angeles, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1965

Summary:

Data are presented from an experiment conducted to measure changes in heat generated at the interface between leads during electronic resistance welding as process parameters were varied The objective was to establish the value of this type of measurement for determining mechanical strength of a joint. The experiment consisted of preparation of microweld specimens, infrared detection of the relative heat generated during welding, physical tests of the samples, and statistical analysis of these data. Results indicate that the amount of heat detected at the material interface during welding may be used for evaluating the quality of the finished weld. Minimum weld strength can be predicted with a confidence of 95%

Notes:

Vendor supplied data

Publisher Number:

650858

Access Restriction:

Restricted for use by site license