Reliability Characteristics of Various Microcircuit Technologies IIT Research Institute

Format:

Conference/Event

Author/Creator:

Klein, M. R., author.

Conference Name:

1977 International Automotive Engineering Congress and Exposition (1977-02-28 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1977

Summary:

This paper presents an analysis of microcircuit reliability data residing in the Reliability Analysis Center (RAC) data bank. Included in this study are SSI, MSI and LSI digital, linear and hybrid microcircuits.Failure rate data are presented for all technologies for both test and operational conditions. Failure mode data are presented for TTL, CMOS and hybrid microcircuits. Effects of package configuration, device complexity and test conditions are reviewed.In summary, this paper provides an overview of microcircuit reliability characteristics as derived from a broadly based ongoing data accumulation effort. These data are offered to users as published reports and as indirect response to specific inquiries

Notes:

Vendor supplied data

Publisher Number:

770227

Access Restriction:

Restricted for use by site license