Reliability Considerations in the Use of Integrated Circuit Packaging Systems in an Automotive Environment

Format:

Conference/Event

Author/Creator:

Thielmann, J. N., author.

Conference Name:

1977 International Automotive Engineering Congress and Exposition (1977-02-28 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1977

Summary:

An overview is presented of integrated circuit technologies, complexities, packaging systems, random infant mortality and wearout failure mechanisms, and automotive environments. Focus is brought to bear on reliability considerations in the use of integrated circuit packaging systems, with special emphasis on the wearout failure mechanisms of plastic versus hermetic packaging systems in automotive environments

Notes:

Vendor supplied data

Publisher Number:

770229

Access Restriction:

Restricted for use by site license