Auto Electronics: A Semiconductor Supplier's Viewpoint

Format:

Conference/Event

Author/Creator:

Cohen, Robert M., author.

Conference Name:

1975 Automotive Engineering Congress and Exposition (1975-02-24 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1975

Summary:

This paper reviews the steps taken by the semiconductor industry to be responsive to the requirements of the automotive industry, with special emphasis on one recently developed and highly cost-effective method to control and improve device reliability. Two new product innovations, one combining MOS and bipolar technology to produce a high performance and versatile operational amplifier integrated circuit, and the other an inherently more reliable process for IC manufacture involving a hermetic silicon die and a corrosion resistant lead connection system are also described, particularly as they relate to automotive applications

Notes:

Vendor supplied data

Publisher Number:

750202

Access Restriction:

Restricted for use by site license