Automation of the Final Assembly Operations on the Thick Film Ignition Module at Delco Electronics

Format:

Conference/Event

Author/Creator:

Wagner, G. M., author.

Conference Name:

1976 Automotive Engineering Congress and Exposition (1976-02-23 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1976

Summary:

This paper discusses the thick film hybrid circuit system used in an under-the-hood application at Delco Electronics. It also covers why the thick film concept was chosen for Delco's electronic ignition, and why almost total automation was chosen to manufacture the ignition. It demonstrates that the thick film hybrid circuit is an ideal system for automotive applications

Notes:

Vendor supplied data

Publisher Number:

760293

Access Restriction:

Restricted for use by site license