High Strength versus Stress Relief In a Structural Bond Sandia Laboratories

Format:

Conference/Event

Author/Creator:

DeLollis, N. J., author.

Conference Name:

1971 Automotive Engineering Congress and Exposition (1971-01-11 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1971

Summary:

In bonding two materials differing in coefficient of expansion, one must either contain the stresses due to temperature cycling using a rigid adhesive, or allow the two adherends to expand and contract freely using an elastomeric adhesive. An experiment is described which demonstrates the extent that stresses can be contained when a rigid adhesive is used to bond materials of greatly different coefficients of expansion

Notes:

Vendor supplied data

Publisher Number:

710108

Access Restriction:

Restricted for use by site license