Residual Stresses in Steel Parts and Single Crystal Silicon

Format:

Conference/Event

Author/Creator:

Pearson, D. A., author.

Conference Name:

1971 Automotive Engineering Congress and Exposition (1971-01-11 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1971

Summary:

Examples are given of the heat treatment residual stress and retained austenite distributions in a carburized part, and the residual stress after grinding in another hardened part. Stress fields around dislocations in silicon wafers due to processing are shown by X-ray topographs, illustrating that residual stresses are also of concern in other materials

Notes:

Vendor supplied data

Publisher Number:

710282

Access Restriction:

Restricted for use by site license