Standing Wave Phenomena Relating to Ultrasonic Bonding Tips

Format:

Conference/Event

Author/Creator:

Dushkes, S. Z., author.

Conference Name:

National Aeronautical and Space Engineering and Manufacturing Meeting (1971-09-28 : Los Angeles, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1971

Summary:

This paper analyzes the required geometry of a tapered tip that terminates the amplifying horn used for ultrasonic bonding of fine wires to small electronic circuit boards. Nearly all the published literature on the ultrasonic bonding power train is concerned with the amplifying horn rather than with the bonding tip. The new application of the ultrasonic bonding technique described here is for circuit boards of extremely high wire density, where the slender bonding tip must penetrate the circuit network to bond a wire to a pad without disturbing the neighboring bonds

Notes:

Vendor supplied data

Publisher Number:

710789

Access Restriction:

Restricted for use by site license