1 option
Fabrication of Multilayer Ceramic Interconnection Boards
- Format:
- Conference/Event
- Author/Creator:
- Kasten, Elliott A., author.
- Conference Name:
- National Aeronautical and Space Engineering and Manufacturing Meeting (1971-09-28 : Los Angeles, California, United States)
- Language:
- English
- Physical Description:
- 1 online resource
- Place of Publication:
- Warrendale, PA SAE International 1971
- Summary:
- The basic procedure for fabricating ceramic multilayer boards, for use with beam lead, flip chip, or flying lead semi-conductor devices is described
- Notes:
- Vendor supplied data
- Publisher Number:
- 710797
- Access Restriction:
- Restricted for use by site license
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