A Thin Film Metallization System for Various Assembly Techniques

Format:

Conference/Event

Author/Creator:

Waufle, Harold E., author.

Conference Name:

National Aeronautical and Space Engineering and Manufacturing Meeting (1971-09-28 : Los Angeles, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1971

Summary:

This paper describes a thin film metallization system using nichrome-nickel-gold on alumina substrates. The system meets the specifications of several company hybrid microelectronic facilities. The capabilities and overall reliability of the deposition system are discussed in relation to the various assembly techniques used by these facilities to produce high reliable circuits

Notes:

Vendor supplied data

Publisher Number:

710802

Access Restriction:

Restricted for use by site license