Semiconductor: Wire Bonding and Face Bonding Considerations and Comparisons Weldmatic Div., Unitek Corporation

Format:

Conference/Event

Author/Creator:

Koshinz, Ernest F., author.

Conference Name:

Micro Electronic Packaging Conference (1968-11-20 : Palo Alto, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1968

Summary:

Begins with a review of semiconductor wire bonding techniques utilizing both thermocompression and ultrasonic methods. Next, disadvantages of using interconnect leadwires are covered. Finally, a description of leadless face bonding is included with emphasis on the important functions in state-of-the-art techniques as well as on simplicity, accuracy and repeatability

Notes:

Vendor supplied data

Publisher Number:

680803

Access Restriction:

Restricted for use by site license