Simplified Automation of Microelectronic Module Interconnections Missile Systems Div., Hughes Aircraft Company

Format:

Conference/Event

Author/Creator:

Fiderer, Leo, author.

Conference Name:

Micro Electronic Packaging Conference (1968-11-20 : Palo Alto, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1968

Summary:

The paper describes a method of interconnecting integrated circuits, hybrid circuits, small encapsulated circuit modules, and certain types of discrete components. It uses simple semi-automatic or completely automated processes which do not require large investment in capital and elaborate equipment. The transition from the circuit designer's interconnection diagram or wiring list to the fabricated interconnection matrix can be effected within minutes or hours instead of days or weeks. The method offers the compactness and complex interconnection capabilities of multi-layer circuit boards, but without long lead times and high cost

Notes:

Vendor supplied data

Publisher Number:

680795

Access Restriction:

Restricted for use by site license