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Paste Transfer in the Screening Process Components Div., International Business Machines Corporation

SAE Technical Papers (1906-current) Available online

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Format:
Conference/Event
Author/Creator:
Miller, L. F., author.
Conference Name:
Micro Electronic Packaging Conference (1968-11-20 : Palo Alto, California, United States)
Language:
English
Physical Description:
1 online resource
Place of Publication:
Warrendale, PA SAE International 1968
Summary:
This discussion describes the relationships of the amount of paste deposited on a ceramic substrate by screening, to certain aspects of the screening process - - such as the mesh size, paste rheology, line width, et cetera It is not intended to be a vigorous mathematical or mechanical analysis of the process.The conclusions can be extrapolated not only to an understanding of a part of the mechanism of paste transfer, but to a prediction of screened thickness - - as well as to methods for increasing the uniformity and thickness of screened images. Emulsion screens with stainless steel mesh and etched metal masks are discussed
Notes:
Vendor supplied data
Publisher Number:
680796
Access Restriction:
Restricted for use by site license

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