In-Process Non-Destructive Microweld Inspection Techniques

Format:

Conference/Event

Author/Creator:

"Tom" Sawyer, H. F., author.

Conference Name:

Micro Electronic Packaging Conference (1968-11-20 : Palo Alto, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1968

Summary:

Degradation of weld strength beyond that which is unacceptable in the end product can always be detected non-destructively. This detection is best made during the weld cycle by monitoring a combination of three parameters: voltage pulse, infrared radiation, and setdown. Other measurements evaluated but found impractical are: eddy current, joint resistance, and sonic/ultrasonic methods. Laboratory experiments show that weld criteria and instrumentation are easily developed

Notes:

Vendor supplied data

Publisher Number:

680798

Access Restriction:

Restricted for use by site license