Design Consideration in Thick Film Hybrid Microcircuits Layout McDonnell Douglas Corporation

Format:

Conference/Event

Author/Creator:

Sobhani, Mohi, author.

Conference Name:

Micro Electronic Packaging Conference (1968-11-20 : Palo Alto, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1968

Summary:

Translation from a schematic to fabrication of a thick film hybrid microcircuit requires a knowledge of both circuit and process design. A lack of information in proper layout procedures often results in circuits which are unnecessarily difficult to fabricate. Design guidelines are given which aid in optimization of the circuit layout. Optimum geometries are discussed with particular emphasis on resistors. Examples of circuits are given from schematic to the finished product to illustrate the design layout procedure

Notes:

Vendor supplied data

Publisher Number:

680801

Access Restriction:

Restricted for use by site license