Laser Welding of Microcircuit Interconnections - Simultaneous Multiple Bonds of Aluminum to Kovar American Optical Corporation

Format:

Conference/Event

Author/Creator:

Battista, A. D., author.

Conference Name:

Micro Electronic Packaging Conference (1968-11-20 : Palo Alto, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1968

Summary:

The development of a laser welder to produce multiple welds/laser pulse for use in a flip-chip process is described. Using a glass laser with a blocking mask to split the laser beam into a multiplicity of spots, the simultaneous welding of all 14 interconnect points between an aluminum interconnect pattern on a glass substrate and an unplated Kovar lead frame is possible, weld shear strength of from 800 1200 grams in eight-spot samples was achieved in an experimental system

Notes:

Vendor supplied data

Publisher Number:

680802

Access Restriction:

Restricted for use by site license