Recent Developments in Applications of Electroless Nickel Plating Allied Research Products, Incorporated

Format:

Conference/Event

Author/Creator:

Mallory, Glenn, author.

Conference Name:

Aeronautic and Space Engineering and Manufacturing Meeting (1969-10-06 : Los Angeles, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1969

Summary:

AbstractRecent developments in the field of electroless nickel plating are outlined. Metal ion reduction by boron-containing reductants is a significant advance and gives deposits which are phosphorus-free, metal-boron alloys. Properties of these deposits such as composition, structure, density, hardness, et cetera are reviewed.Two types of reducing agents can be employed in aqueous electroless nickel systems. This paper stresses the preference for dimethylamine borane (DMAB) in the plating bath. The special properties of nickel-boron alloys and the versatility of DMAB plating baths suggest a number of applications such as plating of electronic components, high temperature applications, and applications where uniformity and thickness of deposits is a basic requirement. The primary limitation of DMAB is the high cost of the chemical which might make certain applications not economically practical

Notes:

Vendor supplied data

Publisher Number:

690646

Access Restriction:

Restricted for use by site license