A Modular Packaging Approach for Dual In-Line Integrated Circuits Elco Corporation

Format:

Conference/Event

Author/Creator:

Martinell, John M., author.

Conference Name:

Electronic Packaging Conference (1967-02-14 : New York, New York, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1967

Summary:

This paper describes the development of a packaging technique using the new dual in-line package. Part one tells why this package was developed and gives some advantages this technique has over present trends in packaging. Part two gives a complete explanation and description of the component parts of the package. The third part elaborates on the heart of the package, namely the interconnection matrix. Details are given on converting from a systems logic diagram to a graphic format used in the development of the matrix layout. Part four explains the step by step procedure used in manufacturing the dual in-line module on both the prototype and production level. The fifth and final part of the paper tells of other packaging techniques using as a basic building block, the internal parts of the dual in-line module

Notes:

Vendor supplied data

Publisher Number:

670207

Access Restriction:

Restricted for use by site license