Developing the Quality Assurance Requirements for a Custom Thin-Film Circuit Program

Format:

Conference/Event

Author/Creator:

Prudhomme, Robert R., author.

Conference Name:

Electronic Packaging Conference (1967-02-14 : New York, New York, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1967

Summary:

Because of the unique problem areas associated with thin film circuit fabrication, a study was initiated to develop the quality assurance requirements for custom thin film circuitry.This study resulted in generating (1) contamination requirements, (2) criteria covering receipt and handling of vendor supplied components and materials, (3) controls for critical thin film processes, (4) necessary inspection points, (5) a closed loop process control and corrective action system, and (6) reliability and failure analysis requirements. Also, the study showed that better non-destructive testing methods need to be developed in order to detect latent defects and thereby, increase circuit reliability

Notes:

Vendor supplied data

Publisher Number:

670212

Access Restriction:

Restricted for use by site license