A New Approach to Parallel-Gap Joining

Format:

Conference/Event

Author/Creator:

Dawes, C. J., author.

Conference Name:

Electronic Packaging Conference (1967-02-14 : New York, New York, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1967

Summary:

One of the major problems in conventional parallel-gap joining methods is overheating. Damage to the copper circuit thus results. The BWRA has designed a new electrode with a metallic insert. The insert which is separated from the electrodes by a thin dielectric acts as a heat sink. Joints made with the new electrode have a large bond area, show little damage to the substrate, and exhibit a characteristic fillet at the edge of the lead. This fillet is a visual indication of a satisfactory joint

Notes:

Vendor supplied data

Publisher Number:

670213

Access Restriction:

Restricted for use by site license