Precision Bonding Utilizing Mechanical Thermal Pulse Techniques Western Electric Company, Incorporated

Format:

Conference/Event

Author/Creator:

Cushman, R. H., author.

Conference Name:

Electronic Packaging Conference (1967-02-14 : New York, New York, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1967

Summary:

The results of a limit study program utilizing Mechancial Thermal Pulse techniques is discussed. The characteristics and capabilities of this unique bonding process will be described. It will be shown that this process makes it feasible to bond through appreciable layers of contaminants without flux and without extensive precleaning. It is also feasible to make multiple bonds with surprisingly simple, rapid equipment. The type of equipment designed to carry out the process will be shown and discussed. Several examples will be included showing various applications of the process in everyday interconnection problems. The "Band & Join" type connection and bonding to unstripped plastic insulated wires and cables will be high lighted

Notes:

Vendor supplied data

Publisher Number:

670214

Access Restriction:

Restricted for use by site license