Packaging for Electromagnetic Compatibility Apollo Support Department, General Electric Company

Format:

Conference/Event

Author/Creator:

Jankowski, Herman, author.

Conference Name:

Electronic Packaging Conference (1967-02-14 : New York, New York, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1967

Summary:

The importance of electromagnetic compatibility (EMC) in electronic systems becomes emphasized as interference problems of increasingly serious nature appear. Packaging to avoid electromagnetic interference effects can provide the major suppression capability in a system.A number of general packaging techniques covering magnetic and electric field suppression, and the avoidance of "common impedance" interference, are presented. Techniques are considered for the three major EMC areas of a system: the sources of interference, the transmission media, and the equipments which react erroneously when interference is present. The need for education in EMC as an integral part of an engineer's training is also emphasized

Notes:

Vendor supplied data

Publisher Number:

670216

Access Restriction:

Restricted for use by site license