The New Look in Avionics Equipment

Format:

Conference/Event

Author/Creator:

Fletcher, K. L., author.

Conference Name:

3rd Annual Business Aircraft Conference (1967) (1967-04-05 : Wichita, Kansas, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1967

Summary:

New packaging concepts for avionics equipment are evolving as a result of extensive use of microcircuits and thin film circuits. These components, essentially planar in configuration, have naturally led to the development of new planar packaging systems. A system of this type currently being implemented uses planar circuit boards of a unique new design and also provides a method of packaging these boards in separate planar sections. Two or more of these sections, each with its own connector and dust cover, may constitute a complete airborne function such as VOR or VHF communication. The sections, which are shorter than standard ARINC units because of increased packaging efficiency, also facilitate equipment installation in smaller aircraft

Notes:

Vendor supplied data

Publisher Number:

670251

Access Restriction:

Restricted for use by site license