Identification of BSR Issues in Electronic Boards Altair Engineering India Pvt., Limited

Format:

Book

Conference/Event

Author/Creator:

Rao, Sohan, author.

Contributor:

Ravi, Chandan

Reddy, Hari

Conference Name:

Noise and Vibration Conference & Exhibition (2023-05-15 : Grand Rapids, Michigan, United States)

Language:

English

Physical Description:

1 online resource cm

Place of Publication:

Warrendale, PA SAE International 2023

Summary:

Currently the world's transportation sector is experiencing a paradigm shift towards electric mobility where electric and electronic components form an integral part of the vehicle. The heavy usage of electronic systems needs large size printed circuit (PCB) boards with multiple subcomponents connected to it. Such a complex electronic system when excited by dynamic loads, would lead to generation of uncomfortable transient rattle events between the parts. As a result, there is an increasing requirement to analyze these subsystems to eliminate any unpleasant noise generation mechanisms. In this study, a PCB has been considered for such an analysis. A linear transient analysis was carried out for a sine-sweep excitation. Risk and root cause analysis was performed, and critical locations were identified. Variation in parameters like material properties, connection stiffness, were considered and analyzed for the same. Finally, design modification iterations were performed in which the system behavior improved substantially. This study would provide a means to quantify the rattle events occurring due to the operating conditions and provide an insight about the performance of the component in the real-world operating conditions

Notes:

Vendor supplied data

Publisher Number:

2023-01-1092

Access Restriction:

Restricted for use by site license