New Serial Microcontroller Links - Micro-Link-Interface and Micro-Second-Channel Infineon Technologies

Format:

Book

Conference/Event

Author/Creator:

Scheibert, Klaus, author.

Conference Name:

SAE 2003 World Congress & Exhibition (2003-03-03 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource cm

Place of Publication:

Warrendale, PA SAE International 2003

Summary:

Trends in today's and future embedded powertrain systems show a strongly growing demand of communication between the functional units inside a car. A cost optimized system partitioning leads to several independent building blocks that have to be interconnected. Depending on the task of each building block, different classes of data exchange can be distinguished, differing in the required bandwidth, the tolerated latency and speed for real time critical tasks. In order to minimize the communication effort concerning time, chip size and overall costs, different communication requirements have been analyzed. The results lead to improvements of standard serial interfaces by application-oriented features.This paper deals with two new approaches for serial interface modules:

Notes:

Vendor supplied data

Publisher Number:

2003-01-0112

Access Restriction:

Restricted for use by site license